%0 Electronic Book
%K Rheology
%K Thermal resistance
%K Density factor
%K Thermal interface materials (TIMs)
%A Daniel Lu
%A C.P Wong
%A Ravi S Prasher
%A Chia-Pin Chiu
%B Materials for Advanced Packaging
%C Cham, Switzerland
%D 2017
%G eng
%I Springer International Publishing
%P 511 - 535
%R 10.1007/978-3-319-45098-8_12
%T Thermal Interface Materials
%7 Second
%@ 978-3-319-45097-1