TY - PAT AU - Anandaroop Bhattacharya AU - Ravi S Prasher AU - Jerome Garcia AU - Suzana Prstic AB -
Embodiments of the present invention include an apparatus, method, and system for an electronic assembly with a thermal management device including a porous medium.
DA - 05/2005 LA - eng M1 - 20050111188:A1 N2 -Embodiments of the present invention include an apparatus, method, and system for an electronic assembly with a thermal management device including a porous medium.
PY - 2005 TI - Thermal management device for an integrated circuit UR - https://patents.google.com/patent/US20050111188A1/en ER -