TY - PAT
AU - Kramadhati Ravi V
AU - Ravi S Prasher
AU - Gregory M Chrysler
AB - <p>An apparatus includes an integrated circuit (IC) die having a substrate formed of a first semiconductor material and a cooling device form of a second semiconductor material. The cooling device is directly mounted to the substrate of the IC die.</p>
DA - 07/2006
LA - eng
M1 - 7071552
N2 - <p>An apparatus includes an integrated circuit (IC) die having a substrate formed of a first semiconductor material and a cooling device form of a second semiconductor material. The cooling device is directly mounted to the substrate of the IC die.</p>
PY - 2006
TI - IC die with directly bonded liquid cooling device
UR - https://patents.google.com/patent/US7071552B2/en
ER -