TY - CPAPER
KW - Silicon
KW - Heat exchangers
KW - Thermal resistance
KW - Cross-flow
KW - Pressure drop
AU - Ravi S Prasher
AU - John Dirner
AU - Je-Young Chang
AU - Alan M Myers
AU - David Chau
AU - Dongming He
AU - Suzana Prstic
AB - <p><span>We have performed a parametric study of the thermal and hydraulic performance of silicon-based micro pin fin heat exchangers with water as the fluid. Circular and square micro pin fins have been fabricated. The pin dimensions ranged from 50 μm to 150 μm. The test chip is unique because it has 20 micro temperature sensors of the size 75 μm × 75 μm to accurately capture the thermal resistance of the micro pin fin heat exchanger. Data shows that there is no difference in the hydraulic and the thermal resistance of circular and square pins. Conventional correlations for friction factor and Nusselt number match well with the data.</span></p>
BT - ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference
DO - 10.1115/IPACK2005-73086
LA - eng
N2 - <p><span>We have performed a parametric study of the thermal and hydraulic performance of silicon-based micro pin fin heat exchangers with water as the fluid. Circular and square micro pin fins have been fabricated. The pin dimensions ranged from 50 μm to 150 μm. The test chip is unique because it has 20 micro temperature sensors of the size 75 μm × 75 μm to accurately capture the thermal resistance of the micro pin fin heat exchanger. Data shows that there is no difference in the hydraulic and the thermal resistance of circular and square pins. Conventional correlations for friction factor and Nusselt number match well with the data.</span></p>
PB - American Society of Mechanical Engineers
PY - 2005
EP - 717–725
T2 - ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference
T3 - ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference
TI - Thermal Resistance and Pressure Drop of Silicon Based Micro Pin Fin Heat Exchanger Under Cross Flow
ER -