An apparatus includes an integrated circuit (IC) die that has a front surface on which an integrated circuit is formed. The IC die also has a rear surface that is opposite to the front surface. The apparatus also includes a microchannel member to define at least one microchannel at the rear surface of the IC die. The microchannel is to allow a coolant to flow through the microchannel. The apparatus further includes at least one thin film thermoelectric cooling (TFTEC) device in the at least one microchannel.
DA - 12/2009 LA - eng M1 - 7633752 N2 -An apparatus includes an integrated circuit (IC) die that has a front surface on which an integrated circuit is formed. The IC die also has a rear surface that is opposite to the front surface. The apparatus also includes a microchannel member to define at least one microchannel at the rear surface of the IC die. The microchannel is to allow a coolant to flow through the microchannel. The apparatus further includes at least one thin film thermoelectric cooling (TFTEC) device in the at least one microchannel.
PY - 2009 TI - Cooling an integrated circuit die with coolant flow in a microchannel and a thin film thermoelectric cooling device in the microchannel UR - https://patents.google.com/patent/US7633752B2/en ER -