TY - PAT
AU - Ashish Gupta
AU - Leonel R Arana
AU - David W Song
AU - Chia-Pin Chiu
AU - Ravi S Prasher
AU - Chris Matayabas
AU - Nirupama Chakrapani
AB - <p>A microelectronic package. The package includes a substrate; a die mounted onto the substrate; an integrated heat spreader mounted onto the substrate, and thermally coupled to a backside of the die; and a sealant material bonding the integrated heat spreader to the substrate, the sealant material having a bulk thermal conductivity above about 1 W/m/° C. and a modulus of elasticity lower than a modulus of elasticity of solder.</p>
DA - 10/2008
LA - eng
M1 - 20080237843:A1
N2 - <p>A microelectronic package. The package includes a substrate; a die mounted onto the substrate; an integrated heat spreader mounted onto the substrate, and thermally coupled to a backside of the die; and a sealant material bonding the integrated heat spreader to the substrate, the sealant material having a bulk thermal conductivity above about 1 W/m/° C. and a modulus of elasticity lower than a modulus of elasticity of solder.</p>
PY - 2008
TI - Microelectronic package including thermally conductive sealant between heat spreader and substrate
UR - https://patents.google.com/patent/US20080237843A1/en
ER -