TY - CPAPER KW - Temperature KW - Microelectronics KW - Thermal conductivity KW - Nanowires KW - Nanostructured materials KW - Superlattices KW - Phonons KW - Boundary-value problems KW - Heat conduction KW - Boltzmann equation KW - Boltzmann transport equation KW - Axial thermal conductiity KW - Ballistic transport KW - Ballistic-diffusive heat conduction KW - Boundary conditions KW - Core nanowires KW - Hollow nanowires KW - Phonon thermal conductivity KW - Radial thermal conductivity KW - Semiconductor nanostructures KW - Shell nanowires AU - Ravi S Prasher AB -
This paper reports on the theoretical modeling of the phonon thermal conductivity of hollow nanowires and core-and shell nanowires. Both the axial and the radial thermal conductivity of hollow nanowires have been analytically modeled by solving the Boltzmann transport equation. The radial thermal conductivity has been modeled using the ballistic-diffusive heat conduction equations. Results for both axial and radial thermal conductivity are in excellent agreement with the numerical solution of the Boltzmann transport equation
BT - Thermal and Thermomechanical Proceedings 10th Intersociety Conference on Phenomena in Electronics Systems, 2006. ITHERM 2006. DO - 10.1109/ITHERM.2006.1645476 LA - eng N2 -This paper reports on the theoretical modeling of the phonon thermal conductivity of hollow nanowires and core-and shell nanowires. Both the axial and the radial thermal conductivity of hollow nanowires have been analytically modeled by solving the Boltzmann transport equation. The radial thermal conductivity has been modeled using the ballistic-diffusive heat conduction equations. Results for both axial and radial thermal conductivity are in excellent agreement with the numerical solution of the Boltzmann transport equation
PY - 2006 EP - 11 pp.–1170 T2 - Thermal and Thermomechanical Proceedings 10th Intersociety Conference on Phenomena in Electronics Systems, 2006. ITHERM 2006. T3 - Thermal and Thermomechanical - 10th Intersociety Conference on Phenomena in Electronics Systems, 2006. ITHERM 2006. TI - Thermal conductivity of hollow nanowires ER -