TY - PAT
AU - Ravi S Prasher
AU - Chia-Pin Chiu
AU - Himanshu Pokharna
AB - <p>An apparatus, method, and system for a thermal management arrangement for cooling semiconductor packages with channels structurally adapted for varying heat flux areas.</p>
LA - eng
M1 - 20050285261:A1
N2 - <p>An apparatus, method, and system for a thermal management arrangement for cooling semiconductor packages with channels structurally adapted for varying heat flux areas.</p>
PY - 2005
TI - Thermal management arrangement with channels structurally adapted for varying heat flux areas
UR - https://patents.google.com/patent/US20050285261A1/en
ER -