TY - CPAPER
KW - Cooling
KW - Heat transfer
KW - Plasma temperature
KW - Temperature distribution
KW - Convection
KW - Microchannel
KW - Heat sinks
KW - Chip maximum junction temperature
KW - Circuits
KW - Cross-linked microchannel heat sink
KW - Electronic equipment
KW - Electronics cooling
KW - Fluid mixing
KW - Heat flux
KW - Hotspots
KW - Integrated circuit reliability
KW - Lateral fluid transport
KW - Mass flow distribution
KW - Materials testing
KW - Microchannel heat sinks
KW - Performance degradation
KW - Reliability degradation
KW - Spatially nonuniform heat flux
KW - Temperature uniformity
KW - Transducers
KW - Two-phase convective heat transfer
AU - Eun Seok Cho
AU - Jae-Mo Koo
AU - Linan Jiang
AU - Ravi S Prasher
AU - Min Soo Kim
AU - J G Santiago
AU - T W Kenny
AU - Kenneth E Goodson
AB - <p><span>Hotspots, imposed by spatially non-uniform heat flux in a high performance circuit, increase the chip maximum junction temperature, which degrades the reliability and performance of electronic equipment. Microchannel heat sinks with two-phase convective heat transfer are effective for removing high heat flux exceeding 100 W/cm/sup 2/. Cross-linking of microchannels can be promising for achieving better temperature uniformity and more effective cooling due to the lateral fluid transport and mixing. This study experimentally investigates the impact of mass flow distribution on the chip temperature field in a multi-channel heat sink. Furthermore, the performance of two microchannel heat sinks is compared with different configurations: a regular microchannel heat sink and a cross-linked microchannel heat sink.</span></p>
BT - Ninteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium, 2003.
DA - 11/2003
DO - 10.1109/STHERM.2003.1194369
LA - eng
N2 - <p><span>Hotspots, imposed by spatially non-uniform heat flux in a high performance circuit, increase the chip maximum junction temperature, which degrades the reliability and performance of electronic equipment. Microchannel heat sinks with two-phase convective heat transfer are effective for removing high heat flux exceeding 100 W/cm/sup 2/. Cross-linking of microchannels can be promising for achieving better temperature uniformity and more effective cooling due to the lateral fluid transport and mixing. This study experimentally investigates the impact of mass flow distribution on the chip temperature field in a multi-channel heat sink. Furthermore, the performance of two microchannel heat sinks is compared with different configurations: a regular microchannel heat sink and a cross-linked microchannel heat sink.</span></p>
PY - 2003
EP - 242–246
T2 - Ninteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium, 2003.
T3 - Ninteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium, 2003.
TI - Experimental study on two-phase heat transfer in microchannel heat sinks with hotspots
ER -