TY - JOUR KW - Model KW - Deposition KW - Energy KW - Target KW - Gas KW - Surface KW - Emission KW - Pulse KW - Copper KW - Behavior KW - Material KW - Ablation KW - Laser KW - Vaporization KW - Intensities KW - Intensity KW - Time KW - Form KW - Inductively coupled plasma (icp) KW - Plasma KW - Sample KW - Sampling KW - Spectrometer KW - Cu KW - Process KW - Crater KW - Mechanism KW - Mechanisms KW - Icp-aes KW - Ga KW - Ionization KW - Atomic emission spectrometry KW - Picosecond KW - Picosecond laser KW - Density KW - Laser sampling KW - Nanosecond KW - Pulsed laser KW - Pulsed laser KW - Targets KW - Laser material interaction KW - Electron KW - Energies KW - Depth KW - Pressure KW - Edge KW - Shock KW - Ar KW - Atmosphere KW - He KW - Plasma shielding KW - Electron density KW - Circulation KW - Electron-density KW - Electrons KW - Superconducting thin-films KW - Gas-pressure KW - High-energy KW - I KW - Inverse bremsstrahlung KW - Media KW - Microfabrication KW - Multiphoton ionization KW - Photoelectron KW - Photoelectrons KW - Shock waves KW - Shock waves KW - Solid materials KW - Via KW - Waves AU - Xianglei Mao AU - Wing-Tat Chan AU - Mark A Shannon AU - Richard E Russo AB -
The influence of plasma shielding on the coupling of laser energy to a target surface during picosecond pulsed laser–material interactions is demonstrated using a He and Ar gas atmosphere. An inductively coupled plasma‐atomic emission spectrometer (ICP‐AES) is used to monitor the quantity of coppermaterial removed during picosecond and nanosecond pulsed‐laser sampling. The intensity of Cu i emission from the ICP‐AES was found to be 16.4 times larger with He as the gas medium compared to Ar during picosecond laser sampling. It was also observed that depth of craters in the copper targets decreased as the gas pressure was increased beyond 10 Torr in Ar and 100 Torr in He. Possible mechanisms of shock waves,multiphoton ionization, and plasma shielding to explain these observations are discussed. For plasma shielding to occur in the picosecond time regime, the existence of high‐energy photoelectrons emitted from a Cu sample during the leading edge of laser pulse is postulated. These electrons form a plasma in the gas above the target via an inverse bremsstrahlung process and the plasma absorbs part of laser energy. The electron density versus pressure was calculated from a simple model and found to have similar behavior as the crater‐depth data.
AD -LAWRENCE BERKELEY LAB,MS 90-2024,BERKELEY,CA 94720
BT - Journal of Applied Physics C2 - LBNL-34478 DA - 10/1993 DO - 10.1063/1.354325 IS - 8 LA - eng LB - Laser N2 -The influence of plasma shielding on the coupling of laser energy to a target surface during picosecond pulsed laser–material interactions is demonstrated using a He and Ar gas atmosphere. An inductively coupled plasma‐atomic emission spectrometer (ICP‐AES) is used to monitor the quantity of coppermaterial removed during picosecond and nanosecond pulsed‐laser sampling. The intensity of Cu i emission from the ICP‐AES was found to be 16.4 times larger with He as the gas medium compared to Ar during picosecond laser sampling. It was also observed that depth of craters in the copper targets decreased as the gas pressure was increased beyond 10 Torr in Ar and 100 Torr in He. Possible mechanisms of shock waves,multiphoton ionization, and plasma shielding to explain these observations are discussed. For plasma shielding to occur in the picosecond time regime, the existence of high‐energy photoelectrons emitted from a Cu sample during the leading edge of laser pulse is postulated. These electrons form a plasma in the gas above the target via an inverse bremsstrahlung process and the plasma absorbs part of laser energy. The electron density versus pressure was calculated from a simple model and found to have similar behavior as the crater‐depth data.
PY - 1993 SP - 4915 EP - 4922 ST - J. Appl. Phys. T2 - Journal of Applied Physics TI - Plasma Shielding During Picosecond Laser Sampling of Solid Materials by Ablation in He Versus Ar Atmosphere VL - 74 ER -