TY - JOUR KW - USA KW - Material KW - Laser KW - Time KW - Ca KW - Plasma KW - Development KW - Picosecond KW - Picosecond laser KW - Processing KW - Electronic material KW - Electronic materials KW - Laser processing AU - Samuel S Mao AU - Ralph Greif AU - Xianglei Mao AU - Richard E Russo AB -

Lasers with picosecond and shorter pulse duration are receiving much attention due to their capabilities for direct-write micromachining on most materials with minimal lateral damage. Deposition of energy from lasers of large power density inevitably creates plasmas that often shield the target and reduce material processing efficiency. Nevertheless, there is little knowledge on the formation and subsequent evolution of plasmas during laser processing of materials at the picosecond time scale. Such information is essential for precise control of laser energy coupling with target materials, particularly for machining at microscale depth.

AD -

Univ Calif Berkeley, Dept Mech Engn, Berkeley, CA 94720 USA Univ Calif Berkeley, Lawrence Berkeley Lab, Berkeley, CA 94720 USA

BT - Journal of Heat Transfer-Transactions of the ASME C2 - LBNL-48386 DA - 08/2000 DO - 10.1115/1.1289642 IS - 3 LA - eng LB - Laser N1 -

LBNL-48386 NOT IN FILE

N2 -

Lasers with picosecond and shorter pulse duration are receiving much attention due to their capabilities for direct-write micromachining on most materials with minimal lateral damage. Deposition of energy from lasers of large power density inevitably creates plasmas that often shield the target and reduce material processing efficiency. Nevertheless, there is little knowledge on the formation and subsequent evolution of plasmas during laser processing of materials at the picosecond time scale. Such information is essential for precise control of laser energy coupling with target materials, particularly for machining at microscale depth.

PY - 2000 SP - 424 EP - 424 ST - J. Heat Transfer T2 - Journal of Heat Transfer-Transactions of the ASME TI - Plasma Development During Picosecond Laser Processing of Electronic Materials VL - 122 ER -