@inproceedings{31206,
  keywords = {Cooling, Heat exchangers, Microchannels},
  author = {Ravi S Prasher and Je-Young Chang},
  title = {Cooling of Electronic Chips Using Microchannel and Micro-Pin Fin Heat Exchangers},
  abstract = {<p><span>The research community is experiencing a revolution in microscale and nanoscale heat transfer, with a focus on developing fundamental experiments and theoretical techniques. More recently, these advancements have begun to influence the design of electronic systems. A futuristic electronic cooling solution might include high efficiency thermoelectric devices made from nanomaterials for the cooling of hotspots on a chip, nano/micro particle laden thermal interface materials and micro-pin fin/microchannel based heat exchanger. Liquid cooling using integrated microscale heat exchangers is a promising future technology to address issues associated with integrated circuit thermal management. In this paper recent advances made by us on technology development of microchannel/micro-pin-fin heat exchangers is presented. Particular attention is given to the impact of hotspots on the performance of microchannel cooling.</span></p>},
  year = {2008},
  journal = {ASME 2008 6th International Conference on Nanochannels, Microchannels, and Minichannels},
  pages = {1881–1887},
  month = {01/2008},
  publisher = {American Society of Mechanical Engineers},
  doi = {10.1115/ICNMM2008-62384},
  language = {eng},
}