@misc{31197,
  author = {Kramadhati Ravi V and Ravi S Prasher and Gregory M Chrysler},
  title = {IC die with directly bonded liquid cooling device},
  abstract = {<p>An apparatus includes an integrated circuit (IC) die having a substrate formed of a first semiconductor material and a cooling device form of a second semiconductor material. The cooling device is directly mounted to the substrate of the IC die.</p>},
  year = {2006},
  number = {7071552},
  month = {07/2006},
  url = {https://patents.google.com/patent/US7071552B2/en},
  language = {eng},
}