@misc{31163,
  author = {Ravi S Prasher},
  title = {Cooling an integrated circuit die with coolant flow in a microchannel and a thin film thermoelectric cooling device in the microchannel},
  abstract = {<p>An apparatus includes an integrated circuit (IC) die that has a front surface on which an integrated circuit is formed. The IC die also has a rear surface that is opposite to the front surface. The apparatus also includes a microchannel member to define at least one microchannel at the rear surface of the IC die. The microchannel is to allow a coolant to flow through the microchannel. The apparatus further includes at least one thin film thermoelectric cooling (TFTEC) device in the at least one microchannel.</p>},
  year = {2009},
  number = {7633752},
  month = {12/2009},
  url = {https://patents.google.com/patent/US7633752B2/en},
  language = {eng},
}