@inproceedings{31159,
  keywords = {cooling, thin films, superlattices, heat flux},
  author = {Ihtesham Chowdhury and Ravi S Prasher and Kelly Lofgreen and Sridhar Narasimhan and Ravi Mahajan and David Koester and Rama Venkatasubramanian},
  title = {Site-Specific and On-Demand High Heat-Flux Cooling Using Superlattice Based Thin-Film Thermoelectrics},
  abstract = {<p><span>We have recently reported the first ever demonstration of active cooling of hot-spots of &gt;1 kW/cm2 in a packaged electronic chip using thin-film superlattice thermoelectric cooler (TEC) cooling technology [1]. In this paper, we provide a detailed account of both experimental and theoretical aspects of this technological demonstration and progress. We have achieved cooling of as much as 15°C at a location on the chip where the heat-flux is as high as ∼1300 W/cm2 , with the help of a thin-film TEC integrated into the package. To our knowledge, this is the first demonstration of high heat-flux cooling with a thin-film thermoelectric device made from superlattices when it is fully integrated into a usable electronic package. Our results, which validate the concept of site-specific micro-scale cooling of electronics in general, will have significant potential for thermal management of future generations of microprocessors. Similar active thermal management could also be relevant for high-performance solid-state lasers and power electronic chips.</span></p>},
  year = {2009},
  journal = {ASME 2009 InterPACK Conference collocated with the ASME 2009 Summer Heat Transfer Conference and the ASME 2009 3rd International Conference on Energy Sustainability},
  pages = {521–526},
  month = {07/2009},
  publisher = {American Society of Mechanical Engineers},
  doi = {10.1115/InterPACK2009-89268},
  language = {eng},
}