@misc{31156,
  author = {Ashish Gupta and Leonel R Arana and David W Song and Chia-Pin Chiu and Ravi S Prasher and Chris Matayabas and Nirupama Chakrapani},
  title = {Microelectronic package including thermally conductive sealant between heat spreader and substrate},
  abstract = {<p>A microelectronic package. The package includes a substrate; a die mounted onto the substrate; an integrated heat spreader mounted onto the substrate, and thermally coupled to a backside of the die; and a sealant material bonding the integrated heat spreader to the substrate, the sealant material having a bulk thermal conductivity above about 1 W/m/° C. and a modulus of elasticity lower than a modulus of elasticity of solder.</p>},
  year = {2008},
  number = {20080237843:A1},
  month = {10/2008},
  url = {https://patents.google.com/patent/US20080237843A1/en},
  language = {eng},
}