@misc{31142,
  author = {Ven R Holalkere and Ravi S Prasher and Stephen Montgomery},
  title = {Integrated stacked microchannel heat exchanger and heat spreader},
  abstract = {<p>Integrated stacked microchannel heat exchanger and heat spreaders for cooling integrated circuit (IC) dies and packages and cooling systems employing the same are disclosed. In one embodiment, a stacked microchannel heat exchanger is operatively and thermally coupled to an IC die or package using an interstitial solder or a solderable material in combination with solder. In another embodiment, a stacked microchannel heat exchanger is operatively and thermally coupled to an IC die or package using an adhesive. In a further embodiment, a stacked microchannel heat exchanger is operatively coupled to an IC die or package by fasteners and is thermally coupled to the IC die or package using a thermal interface material. The integrated stacked microchannel heat exchanger and heat spreaders may be employed in a closed loop cooling system including a pump and a heat rejecter. The integrated stacked microchannel heat exchanger and heat spreaders are configured to support either a two-phase or a single-phase heat transfer process using a working fluid such as water.</p>},
  year = {2006},
  number = {7115987},
  month = {10/2006},
  url = {https://patents.google.com/patent/US7115987B2/en},
  language = {eng},
}