@misc{31116,
  author = {Ravi S Prasher and Ravi Mahajan},
  title = {Two-phase cooling utilizing microchannel heat exchangers and channeled heat sink},
  abstract = {<p>Integrated circuit (IC) packages employing two-phase microchannel heat exchangers for cooling the packages' IC dies and cooling systems employing the same are disclosed. The heat exchangers include thermal masses having a plurality of microchannels formed therein. In one set of configurations, the IC die is thermally coupled to a pair of microchannel heat exchangers disposed on opposite sides of the die. Top-side microchannel heat exchangers include a thermal mass having a plurality of open microchannels having wall bases that are hermetically sealed with the top surface of the die, thus forming a plurality of closed microchannels. Alternatively, a separate microchannel heat exchanger is thermally coupled to an IC die and operatively coupled to the IC die via coupling to a substrate on which the IC die is mounted. Bottom-side heat exchangers include substrates and chip carriers having microchannels formed therethrough that are thermally coupled to the IC die. The cooling systems employ a plurality of microchannel heat exchangers to cool selected electronic components.</p>},
  year = {2005},
  number = {6903929},
  month = {06/2006},
  url = {https://patents.google.com/patent/US6903929B2/en},
  language = {eng},
}