@book{Sauciuc2005-rx,
  author = {Ioan Sauciuc and Ravi S Prasher and Je-Young Chang and Ravi Mahajan and C Migliaccio},
  title = {Bearing life: A future package cooling challenge},
  abstract = {<p>Over the past decade, as silicon technology has continued to scale in accordance with Moore{\textquoteright}s Law, thermal design for cooling microprocessor packages has become increasingly challenging. Due to die shrinkage and other complexities of the microprocessor design, there is a possibility of increased local power densities, commonly referred to as {\textquoteright}hot spots{\textquoteright}. Thermal cooling solutions for package must ensure that the junction temperature of the processor does not exceed temperatures in 90{\textdegree} to 110{\textdegree}C range, typically at the hot spots, to ensure device performance and reliability. A majority of original equipment manufacturers within the microelectronics industry would like to further extend the application of air cooling technologies.</p>},
  year = {2005},
  volume = {14},
  language = {eng},
}