@inproceedings{31086,
  keywords = {Cooling, Heat transfer, Plasma temperature, Temperature distribution, Convection, Microchannel, Heat sinks, Chip maximum junction temperature, Circuits, Cross-linked microchannel heat sink, Electronic equipment, Electronics cooling, Fluid mixing, Heat flux, Hotspots, Integrated circuit reliability, Lateral fluid transport, Mass flow distribution, Materials testing, Microchannel heat sinks, Performance degradation, Reliability degradation, Spatially nonuniform heat flux, Temperature uniformity, Transducers, Two-phase convective heat transfer},
  author = {Eun Seok Cho and Jae-Mo Koo and Linan Jiang and Ravi S Prasher and Min Soo Kim and J G Santiago and T W Kenny and Kenneth E Goodson},
  title = {Experimental study on two-phase heat transfer in microchannel heat sinks with hotspots},
  abstract = {<p><span>Hotspots, imposed by spatially non-uniform heat flux in a high performance circuit, increase the chip maximum junction temperature, which degrades the reliability and performance of electronic equipment. Microchannel heat sinks with two-phase convective heat transfer are effective for removing high heat flux exceeding 100 W/cm/sup 2/. Cross-linking of microchannels can be promising for achieving better temperature uniformity and more effective cooling due to the lateral fluid transport and mixing. This study experimentally investigates the impact of mass flow distribution on the chip temperature field in a multi-channel heat sink. Furthermore, the performance of two microchannel heat sinks is compared with different configurations: a regular microchannel heat sink and a cross-linked microchannel heat sink.</span></p>},
  year = {2003},
  journal = {Ninteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium, 2003.},
  pages = {242–246},
  month = {11/2003},
  doi = {10.1109/STHERM.2003.1194369},
  language = {eng},
}