@misc{31085,
  author = {Abhay A Watwe and Ravi S Prasher},
  title = {Thermal cooling apparatus},
  abstract = {<p>A method and apparatus for cooling a heat source in an electronic device is provided. The apparatus includes a vapor chamber with a heat source at a first end. A heat sink can be provided at a second end of the vapor chamber. The vapor chamber absorbs the heat generated by the heat source. The heat is then transferred via the vapor chamber to a plurality of fins attached to the vapor chamber. If a heat sink is provided, the heat is also transferred via the vapor chamber to the heat sink. The heat sink can also include a plurality of fins. The fins and the heat sink then convectively dissipate the heat to the atmosphere.</p>},
  year = {2003},
  number = {6504721},
  month = {01/2003},
  url = {https://patents.google.com/patent/US6504721B1/en},
  language = {eng},
}